Installation Procedures For Non-VME64xP (VIPA) Compliant Modules To Reduce Damage To VME64xP Subracks, Modules And Transition Modules
 
In an effort to reduce the number of incidents and severity of damage to VME64xP (VIPA) equipment, the Equipment Support Department of the Fermi Computing Division has compiled the following guidelines for the insertion of Non-VME64xP compliant modules into VME64xP subracks.  Extraction instructions can be found here.

Damage Seen in Subracks Returned For Repair
 

NOTE: USERS ARE URGED TO AVOID MODULES WHICH DO NOT COMPLY WITH THE VME64xP ACCEPTED RECOMMENDATIONS
NOTE: THE FOLLOWING INSTRUCTIONS ARE INTENDED ONLY TO BE A GUIDE, AND MAY NOT COVER ALL TYPES OF NON_VME64xP COMPLIANT MODULES.
 

NON-VIPA64x MODULE INSERTION GUIDELINES
 
Non-VME64xP modules typically consist of 6U to 9U adapters, allowing use of standard VME Single Board Computers within the VIPA subrack.  The insertion of non-VME64xP modules and transition modules into VME64xP subracks is accomplished in 4 main steps.  ALWAYS FOLLOW PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES.

1)
Acceptable Vertical AlignmentUnacceptable Vertical Alignment Insert module into guides, ensuring that the module is inserted in the guides for the slots intended.
 
 
 
 
 
 
 
 
 
 

 
 
 
 

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2)
Non-VIPA64x Initial Backplane ContactNon-VIPA64x Initial Backplane Contact Handle Once aligned in the slot, make sure the upper eject handle points toward the top of the subrack.  The lower handle should point toward the bottom of the subrack.  Slowly push the module into the subrack until the module first contacts the backplane connectors.  This can be felt as a sudden increase in effort required to push the module further into the subrack until it "snaps" into position and the eject handles begin to point toward the user.  It can be visually approximated by looking at the eject handles.  They should just be contacting the subrack just inside of the jackscrew plate.  An increase in effort required to push module into subrack prior to initial contact with the backplane indicates that the module is encountering some sort of misalignment or a blockage of the card guides.  Double check to make sure module is in the correct guide rails or remove module and visually inspect the card guides.

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3)
Non-VIPA64x Partial Backplane EngagementNon-VIPA64x Partial Backplane Engagement Handle Using thumbs, begin pushing on the top and bottom of the module, just inside of the jack screws, until the module "clicks" into a partial seating on the backplane.
 
 
 
 
 
 
 
 
 
 
 
 
 

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4)
Non-VIPA64x Full Backplane EngagementNon-VIPA64x Full Engagement Handle Continue pressing the module into the subrack.  Module will "snap" into position as connectors make full contact.  After module is fully seated, it is advisable to run-in the jackscrews to lock the module into place.
 
 
 
 
 
 
 
 
 
 
 
 

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EXTRACTION

Pull handles toward outer edge of module until module snaps out from contact with the backplane.  Pull module out of subrack.
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Created   13-FEB-1998
Modified 21-APR-1998