Installation Procedures For
VME64xP (VIPA) Compliant Modules To Reduce Damage To VME64xP (VIPA) Subracks,
Modules And Transition Modules
In an effort to reduce the number of incidents and severity of damage
to VIPA equipment, the Equipment Support Department of the Fermi Computing
Division has compiled the following guidelines for the insertion of VME64xP
compliant modules into VME64xP subracks. Extraction
instructions can be found here.
VME64xP MODULE INSERTION GUIDELINES
The insertion of modules and transition modules into VIPA64x subracks
is accomplished in 4 main steps. ALWAYS FOLLOW
PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES.
STEP 1)

Insert
module into card guides, ensuring that the module is inserted in the guides
for the slots intended.
STEP 2)
Once
aligned in the slot, make sure the upper capture/eject handle points toward
the top of the subrack. The lower handle should point toward the
bottom of the subrack. Slowly push the module into the subrack until
the module first contacts the backplane connectors. This can be felt
as a sudden increase in effort required to push the module further into
the subrack, and the capture/eject handles will automatically begin to
point toward the user. This can be visually approximated by looking
at the lower capture/eject mechanism. An increase in effort required to
push module into subrack prior to initial contact with the backplane indicates
that the module is encountering some sort of misalignment or a blockage
of the card guides. Double check to make sure module is in the correct
guide rails or remove module and visually inspect the card guides.
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NOTE: INSTALLATION OF TRANSITION
MODULES
Due to the relatively short depth (120 mm) of typical transition modules,
it is common for the connectors to be skewed by as much as 2.5 mm in a
up-down and/or left-right position with respect to the backplane connectors
as the connectors begin to meet. Therefore,
it
is a REQUIRED practice to visually verify the position of the transition
module connectors prior to full mating.
STEP 3)
Using thumbs, begin pushing on the top and bottom of the module, just to
the inside of the capture/eject handles, until the module can no longer
be advanced. Modules with fully loaded J0, J1, J2 and J3 connectors
will require a greater force (up to 60 lbs.) to seat.
When
the module is fully seated in this step, the Capture/Eject handle should
be aligned similar to this image.
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STEP 4)
Pull
the handles toward the center of the module. Module will "snap" into
position as connectors make full contact as the module locks into place.
Modules with fully loaded J0, J1, J2 and J3 connectors will require
a greater force (up to 60 lbs.) to seat.
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EXTRACTION
Pull handles toward outer edge of module until module snaps out from
contact with the backplane. Pull module out of subrack.
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Table
Of Contents
Last Edited 14-APR-98